“Thermal compound products are the weakest link in transferring heat between component and heat sink. Our goal is to eliminate this weak point. We had the idea to do this by using high performance thermal compound products for several years now”, says Eike Salow, computer scientist and founder of Thermal Grizzly.
“We know about the very high expectations of the evergrowing overclocker scene regarding high performance cooling solutions – and we strive to exceed them. To emphasize this claim, we worked closely with extreme overclocker Roman “der8auer” Hartung during development.”
To get closer to the aforementioned goal one step at a time, Thermal Grizzly spent a year developing and classifying chemical compositions, as well as analyzing our competitor’s products. “Finally, we finished our first product line-ups, which satisfy our very high standards as well as those of the overclocking community. We are very proud of what we accomplished in this year”, Eike Salow continues.
Electronic components produce heat through power dissipation. This heat generation shortens the life span of the conponents and reduces their performance over time. Thermal grease and pads are utilized between component and heat sink to slow this process. Our goal is to counteract the degradation of performance and lifespan of electronic components by way of optimal thermal compounds.
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